Iec 60352-5 Pdf Updated May 2026
IEC 60352-5 is the international standard governing solderless press-in connections (often called press-fit) used in electrical and electronic equipment. The current version is Edition 5.0 (2020), which replaced the previous 2012 edition. Overview of the Standard
- Increased reliability: Solderless connections reduce the risk of soldering defects and provide a more reliable interconnect solution.
- Improved manufacturing efficiency: Solderless connections simplify the assembly process, reducing production time and costs.
- Enhanced flexibility: Solderless connections allow for easier repair and rework of PCB assemblies.
Includes definitions for 'metal boards' to reflect current industry trends. New Force Data:
Visual Documentation: Introduced graphs for force documentation and updated figures to illustrate connections where the pin does not protrude through the bottom of the board. iec 60352-5 pdf
: Guidelines for the tools used for insertion and removal to ensure consistent results across different manufacturers. iTeh Standards Testing Methodologies IEC 60352-5 establishes two distinct test schedules: iTeh Standards Qualification Test Schedule
Test Schedules: Includes two distinct schedules—one for qualification (testing individual press-in zones) and one for application (testing the implementation within a specific component). Includes definitions for 'metal boards' to reflect current
IEC 60352-5 is the primary international standard for solderless press-in connections. It provides the essential framework for ensuring that these mechanical connections—often used in place of traditional soldering—remain electrically stable and mechanically sound throughout the lifespan of an electronic device. Overview of IEC 60352-5
, expanded the scope from just telecommunication devices to all electrical and electronic equipment and components. Substrates iec 60352-5 pdf
The standard IEC 60352-5 covers the following aspects: